Open Hardware Cross Reference

AD5564-S3

As of July 18, 2026, ADI marks AD5564 obsolete and lists the AD5532 family as the migration path.

Open AD5564-S3 on TrustCompoView AD5564-S3 datasheet
Status
obsolete
Vendor
Analog Devices Inc./Maxim Integrated
Package
119-BGA
Category
Data Acquisition - Digital to Analog Converters (DAC)

Target product summary

AD5564-S3

ADI marks the AD5564 family obsolete and points designers to AD5532 as the suggested replacement path. We updated this source record to the full MPN AD5564-S3 for public publication consistency, and sustainment users should still recheck package fit, output range, calibration behavior, and interface constraints against the obsolete family datasheet before approving any redesign or field-service substitution.

Series: - | Datasheet landing page: https://www.trustcompo.com/product/detail/TCE000090877-AD5564-S3/datasheet

Replacement candidates

AD5532ABC-2

P2P · Fit score 80

IC DAC 14BIT 32CH 74CSBGA

Package: - | Series: -

Height Seated (Max): 1.7mm; Terminal Finish: Tin/Lead (Sn63Pb37); Time@Peak Reflow Temperature-Max (s): 30; Low-Bias: BINARY

AD5532ABC-1

Functional · Fit score 80

IC DAC 14BIT 32CH 74CSBGA

Package: - | Series: -

JESD-609 Code: e0; RoHS Status: Non-RoHS Compliant; Moisture Sensitivity Level (MSL): 3 (168 Hours); ECCN Code: EAR99

Parameter comparison

Attribute AD5564-S3 AD5532ABC-2 AD5532ABC-1
Number of Channels 32 - -
Application Note Sustainment only; replacement review required - -
Manufacturer Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated Analog Devices Inc./Maxim Integrated
Converter Type D/A CONVERTER D/A CONVERTER D/A CONVERTER
Output Type VOLTAGE OUTPUT Voltage - Unbuffered Voltage - Unbuffered
Lifecycle Status OBSOLETE - -
Package / Case Legacy package variants 74-LBGA, CSPBGA 74-LBGA, CSPBGA
Replacement Path AD5532 family - -
Resolution Legacy family; review obsolete datasheet 1.75 B 1.75 B
Height Seated (Max) - 1.7mm 1.7mm
Terminal Finish - Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Time@Peak Reflow Temperature-Max (s) - 30 30
Low-Bias - BINARY BINARY
Special Feature - Parallel, SPI Parallel, SPI
Packaging - Tray Tray
Lead Free - Contains Lead Contains Lead
Mounting Type - Surface Mount Surface Mount
Part Status - Obsolete Obsolete

Engineer review boundary

This page is designed for first-pass shortlist work. Treat the candidates below as engineering starting points, then verify footprint compatibility, electrical limits, lifecycle timing, compliance requirements, and qualification scope before approving a BOM change. For official sample requests, full data verification, and legal warranty support, please consult through TrustCompo Inquiry Channel.

Evidence summary

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Verification notes

Cross-reference pages are useful starting points, not automatic design approvals. Always re-check footprint, electrical limits, lifecycle timing, qualification documents, firmware implications, and supply-chain constraints before releasing a BOM change. For official sample requests, full data verification, and legal warranty support, please consult through TrustCompo Inquiry Channel.