AD5532ABC-2
P2P · Fit score 80
IC DAC 14BIT 32CH 74CSBGA
Package: - | Series: -
Height Seated (Max): 1.7mm; Terminal Finish: Tin/Lead (Sn63Pb37); Time@Peak Reflow Temperature-Max (s): 30; Low-Bias: BINARY
As of July 18, 2026, ADI marks AD5564 obsolete and lists the AD5532 family as the migration path.
AD5564-S3
ADI marks the AD5564 family obsolete and points designers to AD5532 as the suggested replacement path. We updated this source record to the full MPN AD5564-S3 for public publication consistency, and sustainment users should still recheck package fit, output range, calibration behavior, and interface constraints against the obsolete family datasheet before approving any redesign or field-service substitution.
Series: - | Datasheet landing page: https://www.trustcompo.com/product/detail/TCE000090877-AD5564-S3/datasheet
P2P · Fit score 80
IC DAC 14BIT 32CH 74CSBGA
Package: - | Series: -
Height Seated (Max): 1.7mm; Terminal Finish: Tin/Lead (Sn63Pb37); Time@Peak Reflow Temperature-Max (s): 30; Low-Bias: BINARY
Functional · Fit score 80
IC DAC 14BIT 32CH 74CSBGA
Package: - | Series: -
JESD-609 Code: e0; RoHS Status: Non-RoHS Compliant; Moisture Sensitivity Level (MSL): 3 (168 Hours); ECCN Code: EAR99
| Attribute | AD5564-S3 | AD5532ABC-2 | AD5532ABC-1 |
|---|---|---|---|
| Number of Channels | 32 | - | - |
| Application Note | Sustainment only; replacement review required | - | - |
| Manufacturer | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated | Analog Devices Inc./Maxim Integrated |
| Converter Type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| Output Type | VOLTAGE OUTPUT | Voltage - Unbuffered | Voltage - Unbuffered |
| Lifecycle Status | OBSOLETE | - | - |
| Package / Case | Legacy package variants | 74-LBGA, CSPBGA | 74-LBGA, CSPBGA |
| Replacement Path | AD5532 family | - | - |
| Resolution | Legacy family; review obsolete datasheet | 1.75 B | 1.75 B |
| Height Seated (Max) | - | 1.7mm | 1.7mm |
| Terminal Finish | - | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) |
| Time@Peak Reflow Temperature-Max (s) | - | 30 | 30 |
| Low-Bias | - | BINARY | BINARY |
| Special Feature | - | Parallel, SPI | Parallel, SPI |
| Packaging | - | Tray | Tray |
| Lead Free | - | Contains Lead | Contains Lead |
| Mounting Type | - | Surface Mount | Surface Mount |
| Part Status | - | Obsolete | Obsolete |
This page is designed for first-pass shortlist work. Treat the candidates below as engineering starting points, then verify footprint compatibility, electrical limits, lifecycle timing, compliance requirements, and qualification scope before approving a BOM change. For official sample requests, full data verification, and legal warranty support, please consult through TrustCompo Inquiry Channel.
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Cross-reference pages are useful starting points, not automatic design approvals. Always re-check footprint, electrical limits, lifecycle timing, qualification documents, firmware implications, and supply-chain constraints before releasing a BOM change. For official sample requests, full data verification, and legal warranty support, please consult through TrustCompo Inquiry Channel.